Industrial &
PCB Process Chemistry
Use the dedicated PCB and ammonia pages for category-focused information.
PCB Chemicals Ammoniacal Etchant
Ammoniacal etchant is developed for controlled copper removal in printed circuit board production. It is suitable for spray etching systems where speed, bath stability and line consistency are important. Fresh make-up and replenishment support can be matched to operating copper, pH and production conditions. Technical guidance is available for bath control, undercut reduction and troubleshooting.
PCB Chemicals Nitric-Based Tin Stripper
Tin stripper removes tin or tin-based metallic resist after the copper etching stage. The chemistry is designed to provide effective stripping while supporting a clean copper surface for subsequent processing. Correct control of acidity, metal loading, temperature and dwell time helps maintain consistent results. Kumar Industries provides make-up, operating and bath-maintenance recommendations.
PCB Chemicals H-PLATE CU 400 Acid Copper Brightener
H-PLATE CU 400 is an additive system for acid copper electroplating applications. It supports bright, smooth and uniform copper deposition when the base bath is maintained within recommended limits. The product is suitable for PCB plating processes requiring dependable throwing power and surface appearance. Start-up, dosing and troubleshooting guidance can be provided for production lines.
PCB Chemicals Graphite Direct Metallisation
Graphite-based direct metallisation prepares non-conductive hole walls for subsequent copper electroplating. The process offers an alternative to conventional electroless copper for suitable horizontal PCB lines. Controlled cleaning, conditioning, graphite deposition and drying are essential for reliable conductivity. Kumar Industries supports bath make-up, line start-up and process optimisation.
PCB Chemicals Dry Film Stripper
Dry film stripper removes developed photoresist after etching or plating operations. The formulation is intended for fast and effective resist lifting with practical bath control. Temperature, concentration, spray pressure and contamination level influence stripping speed and cleanliness. Technical support is available for make-up, replenishment and troubleshooting.
PCB Chemicals OSP Surface Finish
OSP forms a thin organic protective coating on exposed copper surfaces. It helps preserve solderability during storage and supports suitable assembly and reflow operations. Cleaning, micro-etching, bath acidity, temperature and contact time must be carefully controlled. Kumar Industries provides process guidance for coating consistency, colour and line performance.
PCB Chemicals Micro-Etch & Process Cleaners
Micro-etch and process cleaners prepare copper surfaces before plating, imaging or final finishing. They remove light oxidation, soils and surface contamination while creating a controlled copper texture. Correct concentration, temperature and treatment time improve adhesion and process repeatability. Product selection can be adjusted to the customer’s production sequence and equipment.
Industrial Chemicals & Gases Liquor Ammonia
Liquor ammonia is supplied for chemical processing, neutralisation, formulation and general industrial use. It offers a convenient aqueous source of ammonia for controlled plant dosing. Batch consistency and concentration control support dependable production performance. Bulk supply and application guidance are available according to customer requirements.
Industrial Chemicals & Gases Anhydrous Ammonia Gas
Anhydrous ammonia is intended for suitable industrial processes requiring concentrated ammonia. Supply must be handled through approved equipment, trained personnel and appropriate safety controls. The product supports chemical manufacturing and other specialised applications. Availability and delivery are subject to statutory, transport and site-handling requirements.